| 器件名 | 厂商 | 描 述 | 功能 |
|---|---|---|---|
| MAX4222EEE-T | Maxim(美信半导体) | High Speed Operational Amplifiers High-speed, single-supply, gain of +2, closed-loop, rail-to-rail buffer w/enable in SOT23 | 下载 |
| MAX4222EEE+T | Maxim(美信半导体) | High Speed Operational Amplifiers Buffers with Enable | 下载 |
| 对应元器件 | pdf文档资料下载 |
|---|---|
| MAX4222EEE+ 、 MAX4222EEE+T 、 MAX4222EEE-T 、 MAX4222EEE/GG8 | 下载文档 |
| MAX4222EEE 、 MAX4222EEE-GH9 、 MAX4222EEE-GH9-T | 下载文档 |
| MAX4222EEE/GH9 、 MAX4222EEE/GH9-T | 下载文档 |
| 型号 | MAX4222EEE+T | MAX4222EEE+ | MAX4222EEE-T | MAX4222EEE/GG8 |
|---|---|---|---|---|
| 描述 | High Speed Operational Amplifiers Buffers with Enable | High Speed Operational Amplifiers Buffers with Enable | High Speed Operational Amplifiers High-speed, single-supply, gain of +2, closed-loop, rail-to-rail buffer w/enable in SOT23 | High Speed Operational Amplifiers High-Speed, Single-Supply, Gain of 2, Closed-Loop, Rail-to-Rail Bufferswith Enable |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 |
| 包装说明 | SSOP, SSOP16,.25 | SSOP, SSOP16,.25 | 0.150 INCH, 0.025 INCH PITCH, QSOP-16 | HSSOP, |
| Reach Compliance Code | compliant | compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | BUFFER | BUFFER | BUFFER | BUFFER |
| 最大平均偏置电流 (IIB) | 12 µA | 12 µA | 12 µA | 12 µA |
| 标称带宽 (3dB) | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| 最大输入失调电压 | 10000 µV | 10000 µV | 10000 µV | 10000 µV |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e0 | e0 |
| 长度 | 4.9 mm | 4.89 mm | 4.89 mm | 4.89 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 最小输出电流 | 0.06 A | 0.06 A | 0.06 A | 0.06 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP | HSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | 260 | 240 | 240 |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | 1.73 mm |
| 标称压摆率 | 600 V/us | 600 V/us | 600 V/us | 600 V/us |
| 供电电压上限 | 12 V | 12 V | 12 V | 12 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | 20 |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| 零件包装代码 | SOIC | SOIC | SOIC | - |
| 针数 | 16 | 16 | 16 | - |
| 封装等效代码 | SSOP16,.25 | SSOP16,.25 | SSOP16,.25 | - |
| 电源 | 3.3/5/+-5 V | 3.3/5/+-5 V | 3.3/5/+-5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - |
| 最大压摆率 | 28 mA | 28 mA | 28 mA | - |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | - |
| Base Number Matches | 1 | 1 | 1 | - |
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